JPH0525181B2 - - Google Patents

Info

Publication number
JPH0525181B2
JPH0525181B2 JP58245125A JP24512583A JPH0525181B2 JP H0525181 B2 JPH0525181 B2 JP H0525181B2 JP 58245125 A JP58245125 A JP 58245125A JP 24512583 A JP24512583 A JP 24512583A JP H0525181 B2 JPH0525181 B2 JP H0525181B2
Authority
JP
Japan
Prior art keywords
peaking
amplifier
present
gaas
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58245125A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60140744A (ja
Inventor
Shutaro Nanbu
Masahiro Nishiuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58245125A priority Critical patent/JPS60140744A/ja
Publication of JPS60140744A publication Critical patent/JPS60140744A/ja
Publication of JPH0525181B2 publication Critical patent/JPH0525181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
JP58245125A 1983-12-28 1983-12-28 半導体集積回路装置 Granted JPS60140744A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58245125A JPS60140744A (ja) 1983-12-28 1983-12-28 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58245125A JPS60140744A (ja) 1983-12-28 1983-12-28 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60140744A JPS60140744A (ja) 1985-07-25
JPH0525181B2 true JPH0525181B2 (en]) 1993-04-12

Family

ID=17128992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58245125A Granted JPS60140744A (ja) 1983-12-28 1983-12-28 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60140744A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0448843A1 (en) * 1990-03-27 1991-10-02 Agfa-Gevaert N.V. Electrophotographic recording material
JP2011019047A (ja) * 2009-07-08 2011-01-27 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS60140744A (ja) 1985-07-25

Similar Documents

Publication Publication Date Title
US5015968A (en) Feedback cascode amplifier
JP4206589B2 (ja) 分布増幅器
US20160134244A1 (en) High-frequency amplifier
US6285257B1 (en) Feedback type variable gain amplifier
US6731174B2 (en) Radio frequency power amplifier device
JPS6043907A (ja) 増幅回路
JP2005501459A (ja) 高周波電力増幅回路
JP2005501459A5 (en])
JPH0525181B2 (en])
JP3303845B2 (ja) 内部整合型出力ｆｅｔ
JPH06125224A (ja) 分布増幅器
Le Ny et al. A 1.9 GHz low noise amplifier
JPS60140907A (ja) 半導体集積回路
EP1227578A2 (en) RF amplifier
JP2903162B2 (ja) 分布増幅器
JPH06252668A (ja) マイクロ波回路
JPH046256Y2 (en])
US10855227B2 (en) Distortion compensation circuit
JP3133864B2 (ja) トランジスタ増幅器
JP2002171144A (ja) 高周波増幅器
JP2998107B2 (ja) 中間周波増幅装置
JPH01205458A (ja) モノリシックマイクロ波集積回路
JP3211729B2 (ja) 増幅器及び電圧制御ゲインコントロール回路
JP3114179B2 (ja) Ｆｅｔ集積装置
JPH1155046A (ja) 高周波増幅器